- HPSP to build on existing high pressure annealing technology and set up new research and development programs to deepen their study in HPA process for various types of semiconductor devices and ...

YESTI, a semiconductor equipment specialist company, announced on the 8th that it has entered the practical design phase for the development of the 'next-generation high-pressure annealing' equipment, ...

Yesty, a semiconductor equipment specialist company, announced on the 20th that it is in discussions to supply high-pressure annealing equipment capable of processing 125 wafers per batch to an ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Aug. 11, 2003--WaferMasters, Inc. today announced that STMicroelectronics is using its SAO-150AP Stacked Annealing Oven at their AG-1 wafer fab in Agrate, Italy to ...

The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in ...