Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...

A new technical paper titled “SCREME: A Scalable Framework for Resilient Memory Design” was published by researchers at University of Central Florida, University of Texas at San Antonio and University ...

SAN FRANCISCO, July 29 (Reuters) - Enfabrica, a Silicon Valley-based chip startup working on solving bottlenecks in artificial intelligence data centers, on Tuesday released a chip-and-software system ...

What's new in memory technology? What's new in storage technology? How chiplets and chip packaging are affecting storage and memory applications. There's a lot being shown at this year's conference ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...